ATV Technologies SRO702

The ATV Technologies SRO702 is a solder reflow oven engineered for precision microelectronic assembly in R&D, process development, and production settings. Its cold-wall IR-lamp-heated process chamber delivers independent dual-zone temperature control with 24 individually-controlled heater elements, reaching 450°C with ±0.5°C accuracy. The system achieves ramp rates exceeding 200°C/min (up) and 100°C/min (down) with a 500 g load, making it suitable for die attachment, MEMS package sealing, and thermal annealing applications requiring rapid thermal cycling.

## Technical Specifications

**Temperature Control:**
• Maximum temperature: 450°C
• Temperature control accuracy: 200°C/min (500 g load)
• Ramp-down rate: >100°C/min (500 g load)
• Heating elements: 24 individually-controlled IR lamps
• Dual-zone independent operation

**Vacuum & Atmosphere:**
• Vacuum level (diaphragm pump): <5 mbar
• Vacuum level (turbo molecular pump): <5×10⁻⁵ mbar
• Achievable oxygen level: <3 ppm
• Process gases: N₂, forming gas (95/5), Ar, H₂ (H₂ requires SRO-702-H2 safety option)
• Cooling gas: N₂ or Ar, max. 2 bar
• Optional oxygen monitoring system (SRO-70X-OM)

**Conveyor & Chamber:**
• Conveyor: Stainless steel mesh belt, 30–50 meters/hour
• Process chamber: 147 mm × 217 mm × 40 mm height
• Chamber clearance above heated surface: 40 mm

**Cooling System:**
• Cooling water: 2 bar minimum differential pressure, max. 35°C inlet
• Maximum absolute water pressure: 4 bar (60 psi)
• Air blower for rapid temperature control
• Optional water chiller (SRO-70X-WC)
• Adjustable cooling section available

**Electrical:**
• Power: 208 VAC, 30 A, 60 Hz (NEMA L2130 plug)
• Alternative: 120–208 V, 3-phase, 60 Hz, 25 A or 8 kW

**Control & Interface:**
• 19-inch color LCD display (16-character LCD alternative)
• 8-segment ramp & soak profile programming
• Profile memory: Up to 10 saved profiles
• Keypad and touchscreen user interface options
• RS-232 interface

## Key Features

• Cold-wall chamber design isolates thermal stress from system walls
• Rapid thermal ramp and soak capability for time-sensitive processes
• Dual-zone independent heater control for complex thermal profiles
• Ultra-low oxygen capability supports inert and reducing atmospheres
• Flexible gas compatibility including hydrogen (with safety option)
• Configurable cooling section with optional external chiller integration

## Typical Applications

• Die attachment and flip-chip assembly
• MEMS package sealing and hermetic bonding
• Thermal annealing and brazing operations
• Process development and rapid prototyping in semiconductor manufacturing
• Research applications requiring precise atmospheric control

## Compatibility & Integration

The system operates on standard 3-phase 208 VAC service and interfaces via RS-232 for external process control. Optional oxygen monitoring and water chilling systems integrate via standard fittings. Gas exhaust connects via 8 mm Swagelok fitting (max. 2 m line length recommended).