BP Microsystems ASM160QC Automated QFP Socket Module

The BP Microsystems ASM160QC is an automated socket module engineered for high-volume programming of 160-pin Quad Flat Package (QFP) integrated circuits. Operating with QFP devices measuring 28mm × 28mm at 0.65mm pitch, this module delivers precision alignment and contact integrity within automated programming systems. The ASM160QC integrates signal and ground planes with controlled impedance architecture to minimize noise and ground bounce, ensuring reliable vector testing and accurate device programming across production environments.

## Technical Specifications

• Package type: Quad Flat Package (QFP)
• Pin count: 160 pins
• Device footprint: 28mm × 28mm
• Module footprint: 31.9mm × 31.9mm
• Pitch: 0.65mm
• Module type: Automated socket module

## Key Features

• Automated operation for high-volume production throughput
• Precision contact alignment and QFP device positioning
• Multiple-layer PCB construction with ground planes
• Controlled impedance design for signal integrity
• Active circuitry to suppress noise, ground bounce, and overshoot
• Electro-mechanical interface optimized for high-speed communication between programmer and device under test (DUT)

## Typical Applications

• Automated QFP integrated circuit programming in manufacturing
• High-volume semiconductor device testing and validation
• Production environments requiring consistent signal and ground integrity

## Compatibility & Integration

The ASM160QC is designed for use with BP Microsystems automated programming systems and is compatible with 6th and 7th generation programmers. Compatibility with 9th generation systems is possible. The module integrates with BP Microsystems’ standardized socket interface architecture, supporting tens of thousands of devices from multiple semiconductor manufacturers across various IC technologies and package types.