JDSU / Viavi MAP-280 / MAP-200 Series Benchtop Mainframe Controller

The JDSU/Viavi MAP-280/MAP-200 Series Benchtop Mainframe Controller is a modular platform for optical test and measurement in laboratory and manufacturing environments. It manages interchangeable test modules to deliver optical, transport, and data communication testing across network infrastructure and optical transmission element development. The MAP-280 houses 8 slots; the MAP-230B provides 3 slots. Both stand 3 RU high and support cost-effective, scalable deployment with field-replaceable power supplies and flexible remote control interfaces.

– Technical Specifications

Mainframe Options
• MAP-280: 8-slot configuration, 49.6 × 14.9 × 42.0 cm, 6.8 kg
• MAP-230B: 3-slot configuration, 29.2 × 14.9 × 42.0 cm, 5.9 kg
• Standard or factory-reversed fiber routing available on MAP-280

Power
• Input: 100 to 200 V AC, 50/60 Hz, auto-switching
• Consumption: 285 VA
• Supply voltage fluctuation tolerance: ±10% nominal
• Field-replaceable power supply controller module

Remote Interfaces
• USB: 2 rear, 2 front ports (keyboard, mouse, memory stick compatible)
• GPIB: 1 rear port
• LAN: 1 front, LXI-compliant Ethernet (10/100/1000Base-T)
• LXI Triggers: 25-pin Micro-D connectors
• DVI: Video output for external display

Environment
• Operating: 0 to 50°C
• Storage: −30 to 60°C
• Humidity: 15–80% RH, 0 to 40°C noncondensing
• Altitude certified: 2,000 m

– Key Features

• Modular architecture supports interchangeable modules: signal conditioning, switching, sources, amplifiers, power meters
• Bench-top rubber feet with vibration isolation included; optional rack-mount kits available
• Optional MAP-200KD keypad/display module with scroll wheel, seven soft keys, five navigation buttons, seven pre-assigned GUI buttons
• Broad module compatibility within dense, configurable framework

– Typical Applications

• Insertion loss and dispersion penalty testing
• Optical transmission network element manufacturing
• Service and infrastructure testing across network layers

– Compatibility & Integration

The modular platform accepts a broad portfolio of test modules, enabling mixed-application deployments. All interfaces—USB, GPIB, Ethernet—support remote automation and integration into automated test environments.