NI PXI-2532 High-Density Multiconfiguration Matrix Switch Module

The NI PXI-2532 is a 512-crosspoint, high-density matrix switch module for the PXI platform, delivering flexible signal routing across 16 independent banks. Reed relays with rhodium contacts enable switching of both high and low voltages up to 100 V channel-to-channel or channel-to-ground, with a maximum switching power of 10 W and current capacity of 0.5 A per channel. The module supports 1-wire and 2-wire topologies ranging from 4×128 to scalable configurations exceeding 4×2176 with external expansion, making it ideal for multichannel automated test systems.

– Technical Specifications

The PXI-2532 integrates 512 crosspoints across 16 matrix banks using mechanical reed relays rated for 1 × 10⁹ mechanical cycles and 1 × 10⁷ electrical cycles (low power) to 5 × 10⁵ cycles (higher power). Relay operate and release times are 0.25 ms each, with a maximum cycle speed of 2,000 cycles/s. The module accommodates simultaneous actuation of up to 40 relays in PXI chassis or 64 relays in PXIe chassis. Onboard relay cycle tracking monitors contact life automatically.

Electrical performance includes 100 V maximum switching voltage (both channel-to-channel and channel-to-ground, Measurement Category I), 500 V impulse withstand, 10 W maximum switching power per channel, and 0.5 A maximum switching or carry current. Bandwidth reaches ≥30 MHz for 1-wire configurations and ≥25 MHz for 2-wire. Power consumption is 10 W at 5 V in PXI chassis or 15 W at 12 V in PXIe chassis.

– Key Features

• Reed relays with rhodium contact material for durability and low distortion
• Configurable topologies: 4×128, 8×64, 16×32, dual and quad variants, up to 4×2176 with expansion
• Hardware trigger support via PXI trigger lines 0–7 with minimum pulse width of 150 ns
• Multiple-module synchronization capability
• Relay cycle counting for predictive maintenance
• Samtec ERM8-EM or BTE-EM connectors for high-density I/O integration

– Typical Applications

Automated test systems requiring multi-channel signal routing, component characterization, fault insertion, and multichannel measurement multiplexing across low-voltage control and moderate power switching domains.

– Compatibility & Integration

3U, single-slot PXI/PXIe form factor. I/O via two 150-position or 160-position Samtec connectors. Terminal block expansion headers enable scalable matrix configurations. Dimensions: 18.5 × 2.0 × 13.0 cm (7.3 × 0.8 × 5.1 in.) or 21.6 × 2.0 × 13.0 cm (8.5 × 0.8 × 5.1 in.). Weight: 454 g.