The SEC SF160FCT is a high-resolution micro-focus X-ray inspection system for semiconductor devices, PCB assemblies, and electronic components. Its 160 kV micro-focus open tube with 0.8–0.9 µm focal spot achieves magnifications up to 4,800x, enabling detection of micro-scale defects with exceptional clarity. The 6-axis manipulator (X, Y, Z, Tilt to 70°, R, Y-aft) permits imaging from virtually any angle. Dual flat-panel detector options—1.6M or 3.2M pixel—support 30 fps acquisition across a 153 × 204 mm active area. The system delivers both 2D and 3D Computed Tomography via oblique and cone-beam methods, with 3D reconstruction matrices up to 2048³ and sub-10-second reconstruction times using the Feldkamp algorithm.
– Technical Specifications
X-ray Tube
• Micro-focus open tube, 160 kV maximum
• Focal spot: 0.8–0.9 µm
• Standard current: 200 µA; optional 500 µA
Imaging
• Detector: 1.6M or 3.2M pixel flat-panel (153 × 204 mm active area)
• Frame rate: 30 fps
• Magnification: up to 4,800x
Computed Tomography
• Methods: oblique and cone-beam CT
• Max. reconstruction matrix: 2048³
• Reconstruction time: <10 seconds
• Algorithm: Feldkamp cone-beam
• Scan modes: full, half, oblique
Manipulator
• 6-axis: X (400 mm), Y (450 mm), Z (200 mm), tilt (±70°), rotation (360°)
• Standard stage: 460 × 510 mm; optional 550 × 650 mm
• Load capacity: 5 kg
Workstation
• Dual 24-inch displays
• Intel Pentium i5 processor
• 8 GB RAM
• 500 GB HDD + 250 GB SSD
– Key Features
• Ultra-fine 0.8–0.9 µm focal spot for high-magnification detail
• Oblique CT technology overcomes sample-size constraints on 3D analysis
• Dual CT function available as optional upgrade
• Flexible detector options for throughput versus resolution trade-offs
• 6-axis positioning enables comprehensive 3D defect characterization
– Typical Applications
• SMT assemblies: BGA, CSP, solder-joint voids, bridging, auto voiding calculations
• Semiconductor packaging and LED: wire bonding, bump, delamination, cracks, 3D packages (MCP, TSV, FCB)
• Multilayer PCBs: pattern opens/shorts, via alignment, copper wall inspection; flexible PCB blind vias
• Electronic components: connector wire connections, camera module assembly
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