The Sigma Systems TP781 is a cryogenic thermal platform engineered for precision temperature control in demanding test environments. It delivers rapid thermal transitions across an extended temperature range, supporting low-profile components including RF devices, IGBTs, and MOSFETs. The system combines a compact 11″ × 11″ (27.9 cm × 27.9 cm) working surface with intelligent PID control algorithms, offering benchtop efficiency without compromising thermal performance or operational reliability.
– Technical Specifications
Thermal Performance
• Temperature Range: −100°C to +200°C (LN2); −60°C to +200°C (LCO2); optional −165°C to +250°C (LN2 extended)
• Cooling Rate: 30°C to 83°C per minute (typical)
• Heating Rate: 17°C to 61°C per minute (typical)
• Working Surface: 121 in² (781 cm²) precision ground flat, hard anodized aluminum
Controller & Measurement
• Temperature Measurement Range: −210°C to 680°C
• Accuracy: ±1.0°C
• Resolution: 0.1°C full scale
• Display: 5.7″ color touchscreen with graphing and charting
• Control: Primary loop PID, dual loop, settable DUT control
• Diagnostics: Runtime hours (controller, chiller, blower), valve activation counts, enclosure temperature, system performance log
Electrical Requirements
• Input: 100−120 VAC / 50−60 Hz / 1PH / 15A−30A or 200−240 VAC / 50−60 Hz / 1PH / 13A−32A
• General Range: 100−250 VAC, 50/60 Hz, up to 30A (application dependent)
Communication
• Standard: Ethernet 10/100, Telnet, HTML web server, USB 2.0
• Optional: RS232 serial, IEEE-488 GPIB
Physical
• Platform Dimensions: 3.2″H × 12.0″W × 16.5″D (8.1 cm × 30.5 cm × 42.0 cm)
• Mounting: Benchtop or optional shelf rack
• Operating Environment: 10°C to 50°C ambient, 10% to 50% humidity
– Key Features
• Selectable coolants: LN2 or LCO2 for application-specific thermal range optimization
• Independent Fail-Safe Module (IFM) available for temperature limit enforcement
• Epoxy powder coated cabinet construction
• CE, RoHS, designed to meet UL 61010
– Typical Applications
RF component characterization, power semiconductor thermal cycling, low-profile device conditioning, bench-level thermal stress testing.
– Compatibility & Integration
Supports Sigma C, CC3, CC3.5, C4, and C5 command set functionality.
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