The Tektronix 370 Programmable Curve Tracer is a DC parametric characterization instrument for semiconductor device testing. It delivers high-resolution measurement and sourcing capabilities across voltage and current ranges suitable for R&D, SPICE parameter extraction, failure analysis, manufacturing test, process monitoring, and component matching.
– Technical Specifications
Collector Supply
• Voltage: Up to 2000 V or ±2000 V
• Current: Up to 10 A or ±20 A continuous; 20 A peak pulsed capability
• Modes: AC, ±DC, ±Leakage, ±Rectified Sine
• Power: Up to 220 W
• Series Resistance: 0.26 Ω to 800 Ω across ranges
• Resolution: 0.1% increments from 0 to 100% of maximum peak voltage
Step Generator
• Current Amplitude: 50 nA to 200 mA in 1-2-5 sequence
• Voltage Amplitude: 50 mV to 2 V in 1-2-5 sequence
• Steps: 0 to 10 configurable
• Offset: ±10× step amplitude
• Maximum Voltage: 20× step amplitude
• Maximum Current: ≥500 mA at ≤10 V
• Short Circuit Current Limiting: 500 mA (+50%, −20%)
• Ripple + Noise: <0.5% × step amplitude + 10 mV
• Pulse Width: 80 µs or 300 µs (±10%)
• Step Rates: 2× line frequency (1× in AC collector supply mode)
Measurement Capabilities
• Collector Current: 100 nA/div to 2 A/div (1 nA resolution); down to 100 pA/div with X10 magnification
• Accuracy (Collector Current): Within 1.5% of readout + 0.05 div + 1 nA
• Emitter Current: 1 nA/div to 2 mA/div (10 pA resolution)
• Collector Voltage: 50 mV/div to 500 V/div; extends to 5 mV/div with X10 magnification
• Accuracy (Voltage): Within 3% unmagnified and magnified
• Base/Emitter Voltage: 50 mV/div to 5 V/div; extends to 5 mV/div with X10 magnification
– Key Features
• Programmable sourcing with variable voltage and current in 0.1% increments
• Stair-step and pulsed measurement modes for transient characterization
• Extended resolution down to picoampere and microvolt scales
• Flexible series resistance control across wide voltage ranges
• DC and AC sourcing with multiple biasing configurations
– Typical Applications
• SPICE model parameter extraction
• Semiconductor failure analysis and characterization
• Manufacturing incoming inspection and process monitoring
• Component matching and binning
• Device research and development
– Compatibility & Integration
The 370 platform supports multiple configurations (370A, 370B variants) with scalable current and voltage ranges optimized for different device classes.























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