The Teledyne LeCroy T3SP15D is a high-resolution Time Domain Reflectometer (TDR) engineered for signal integrity analysis and impedance characterization across 10 GHz to 15 GHz. It delivers true differential and single-ended TDR measurements with calibrated S-parameter capability, enabling precise fault localization in high-speed interconnects, PCBs, cables, and connectors. With typical rise times of 30–35 ps, the T3SP15D achieves spatial resolution down to 1 mm or better, facilitating detailed impedance discontinuity detection and reflection analysis. The instrument supports automatic ohmic loss compensation, inter-pair and intra-pair skew analysis, and impedance profile measurement. Its compact form factor—220 × 210 × 82.5 mm, approximately 10 lbs—suits laboratory, production, and field-service deployment.
– Technical Specifications
• Frequency Range: 10 GHz to 15 GHz
• Rise Time: 35 ps and 30 ps (typical)
• Spatial Resolution: 3 mm (35 ps); <1 mm (30 ps)
• Pulse Repetition Rate: 1–10 MHz (standard); 500 kHz (T3SP15D-XR)
• Sampling Interval: 10 ps (standard); 20 ps, 40 ps (T3SP15D-XR)
• Maximum Cable Length: 30 m at 1 MHz; up to 40 m (standard); 50 m at 500 kHz (T3SP15D-XR)
• Memory Depth: Up to 50,000 points
• Step Amplitude: 150 mV single-ended; 300 mV differential (50 Ω termination)
• Impedance: 50 Ω
• Resolution: 10–12 bits
– Key Features
• True differential and single-ended TDR modes
• Calibrated S-parameter measurements: Sdd11 differential; S11, S21, S12, S22 single-ended to 15 GHz
• Characteristic impedance profile measurement
• Inter-pair and intra-pair skew analysis
• Automatic ohmic loss compensation
• OSL and OSLT calibration standards with torque-wrench support
• Phase-matched 50 Ω cables included
– Data Output & Integration
• Export formats: CSV, Matlab, Touchstone 1.0, PDF-Report
• 50 ± 1 Ω phase-matched cable accessories
– Typical Applications
• High-speed PCB and interconnect characterization
• Cable and connector impedance verification
• Transmission line fault detection and localization
• Signal integrity validation in R&D and production environments
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