Zygo NewView 200

The Zygo NewView 200 is a 3D optical surface profiler that uses Scanning White Light Interferometry (SWLI) to deliver non-contact measurement and characterization of surface topography. It combines optical microscopy with interferometric analysis to capture high-resolution 3D surface data, then processes it through advanced software for quantitative characterization of roughness, texture, and form. The instrument serves demanding quality control and research applications across semiconductors, disk drives, printing plates, and fuel injector seals.

– Technical Specifications

• Measurement Technique: Scanning White Light Interferometry (SWLI)
• Vertical Resolution: 0.1 nm
• Measurement Repeatability: 0.1 nm Rq
• Lateral Resolution: 0.3 µm to 20 µm
• Accuracy: Better than 0.75%
• Image Depth Range: <1 nm to 5000 µm
• Z-Scan Speed: Up to 4.0 µm/s
• Vertical Travel (Stage): 130 mm (5.1 in)
• Stage Load Capacity: Parts up to 150 mm × 150 mm × 100 mm
• Camera Resolutions: 320 × 240 or 640 × 480 pixels (software-selectable)
• Objectives: 2.5X to 50X magnifications
• Zoom Range: 0.5X to 2.0X continuous
• Field of View: Variable by objective and zoom; capable of imaging features down to 0.5 µm
• Image Stitching: Multi-image stitching for larger area mapping
• Light Source: Filtered white light

– Key Features

• Infinite conjugate Nikon optical path with industry-standard microscopy components
• Parcentric tip and tilt stage with motorized X and Y translation options
• Manual focus with coarse, medium, and fine adjustment knobs
• Manual or automatic illumination control
• MetroPro software for acquisition and analysis with real-time SPC, integrated data logging, and user-definable Go/NoGo flags for hundreds of reportable parameters
• Frequency Domain Analysis (FDA) for advanced mathematical structure characterization
• Point-and-click or dedicated function key control modes
• Reduces total inspection time and cost for wafer and mask inspection workflows

– Typical Applications

Semiconductor metrology, disk drive components, printing plate inspection, fuel injector seal characterization.